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Specialized Microscopy Systems

Product Introduction

Professional microscopy systems designed for specialized application requirements, including short-wave infrared, differential interference contrast, brightfield metallographic, fluorescence, polarizing light, and other microscopy techniques.

Product Features

  • Specialized design optimized for specific applications
  • High-quality optical components
  • Modular configuration for easy expansion
  • Suitable for research and industrial inspection
  • Complete system solutions
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Find the right microscopy system for your application needs

Specialized Microscopy Systems

Professional microscopy systems designed for specialized application requirements, including short-wave infrared, differential interference contrast, brightfield metallographic, fluorescence, polarizing light, and other microscopy techniques.

BSM - Short-Wave Infrared (SWIR) Microscopy System

The BSM Series modular SWIR microscopy system represents a new generation of Short-Wave Infrared imaging technology platform, extending the imaging ra...

Main Features
  • Full coverage of 900-1700 nm SWIR imaging band
  • Silicon material penetrative imaging technology for non-destructive internal inspection
  • Three tube lens systems available (BSM-T180VA/T090VA/T100VA)
  • Maximum 33 mm image field design, compatible with large-format sensors
  • M Plan Apo NIR professional objective series (5X-50X HR)
  • 0.4 µm ultra-high optical resolution (50X HR objective)
  • Coaxial epi-illumination Köhler illumination system
  • Integrated 1200/1300/1400/1550 nm multi-wavelength LED light sources
  • Compatible with high-performance InGaAs sensor cameras (0.33M-5.0M)
  • Real-time imaging capability with frame rates up to 400 fps@640×512
  • TEC cooling technology ensuring low-noise, high SNR imaging
  • Standard C-mount design compatible with various camera systems
  • Modular architecture supporting flexible customization and upgrades
  • Precision CNC machining with anti-vibration design
  • Standard glass optical system for cost-effectiveness optimization
Application Fields
Semiconductor inspection Materials analysis Biomedical research
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DIC100 - Differential Interference Contrast Microscopy System

DIC (Differential Interference Contrast) microscopy system utilizes the principle of dual-beam polarization interference, with the following process:
...

Standard Working Distance Objective Parameters (45 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
DIC2.5XA 2.5X 0.075 6.2 mm 80 mm 4.46 µm 10 mm 25 mm M26×0.705
DIC5XA 5X 0.15 23.5 mm 39 mm 2.2 µm 5 mm 25 mm M26×0.705
DIC10XA 10X 0.3 22.8 mm 20 mm 1.1 µm 2.5 mm 25 mm M26×0.705
DIC20XA 20X 0.4 19.2 mm 10 mm 0.8 µm 1.1 mm 25 mm M26×0.705
DIC50XA 50X 0.55 11 mm 4 mm 0.6 µm 0.44 mm 25 mm M26×0.705
Long Working Distance Objective Parameters (60 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
DICL2XA 2X 0.055 33.7 mm 100 mm 6.1 µm 12.5 mm 25 mm M26×0.705
DICL5XA 5X 0.14 33.6 mm 40 mm 2.2 µm 5 mm 25 mm M26×0.705
DICL10XA 10X 0.28 33.4 mm 20 mm 1.2 µm 2.5 mm 25 mm M26×0.705
DICL20XA 20X 0.34 29.5 mm 10 mm 0.8 µm 1.25 mm 25 mm M26×0.705
DICL50XA 50X 0.5 18.9 mm 4 mm 0.7 µm 0.5 mm 25 mm M26×0.705
Main Features
  • Standard/Long working distance objective series (optional)
  • Imaging optical path: 1X (tube lens focal length 180 mm), customizable with different magnification reducers
  • Imaging path image field size: 25 mm
  • Imaging path spectral range: Visible light
  • Camera interface: C/M42/M52 optional
  • Illumination method: Critical/Köhler illumination optional
  • Illumination source: 10 W white/blue LED illumination optional
Application Fields
Cell biology Materials science Quality control Particle detection
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BMM100 - Brightfield Metallographic Microscopy System

The Brightfield Metallographic Microscope consists primarily of three major systems: illumination system, imaging system, and mechanical system. It is...

Standard Working Distance Objective Parameters (45 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
BF5XA 5X 0.15 22 mm 36 mm 2.23 µm 5 mm 25 mm M20×0.705
BF10XA 10X 0.3 15 mm 18 mm 1.1 µm 2.5 mm 25 mm M20×0.705
BF20XA 20X 0.4 10 mm 9 mm 0.75 µm 1.25 mm 25 mm M20×0.705
BF50XA 50X 0.8 2.5 mm 3.6 mm 0.41 µm 0.5 mm 25 mm M20×0.705
Long Working Distance Objective Parameters (60 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
BFL2.5XA 2.5X 0.075 6.2 mm 80 mm 4.46 µm 10 mm 25 mm M26×0.705
BFL5XA 5X 0.15 23.5 mm 40 mm 2.2 µm 5 mm 25 mm M26×0.705
BFL10XA 10X 0.3 22.8 mm 20 mm 1.1 µm 2.5 mm 25 mm M26×0.705
BFL20XA 20X 0.4 19.2 mm 10 mm 0.8 µm 1.1 mm 25 mm M26×0.705
BFL50XA 50X 0.55 11 mm 4 mm 0.6 µm 0.44 mm 25 mm M26×0.705
Main Features
  • Standard/Long working distance objective series (optional)
  • Imaging optical path: 1X (tube lens focal length 180 mm), customizable with different magnification reducers
  • Imaging path image field size: 25 mm
  • Imaging path spectral range: Visible light
  • Camera interface: C/M42/M52 optional
  • Illumination method: Critical/Köhler illumination optional
  • Illumination source: 10 W white/blue LED illumination optional
Application Fields
Metal material inspection Metallurgical analysis Industrial quality control Non-metallic material inspection
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PLM100 - Professional Polarizing Light Microscopy Imaging Solution

The Polarizing Light Microscope is a microscope used for studying both transparent and opaque anisotropic materials. Any material with birefringence c...

Standard Working Distance Objective Parameters (45 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
POL2.5XA 2.5X 0.075 6.2 mm 80 mm 4.46 µm 10 mm 25 mm M26×0.705
POL5XA 5X 0.15 23.5 mm 39 mm 2.2 µm 5 mm 25 mm M26×0.705
POL10XA 10X 0.3 22.8 mm 20 mm 1.1 µm 2.5 mm 25 mm M26×0.705
POL20XA 20X 0.4 19.2 mm 10 mm 0.8 µm 1.1 mm 25 mm M26×0.705
POL50XA 50X 0.55 11 mm 4 mm 0.6 µm 0.44 mm 25 mm M26×0.705
Long Working Distance Objective Parameters (60 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
POLL2XA 2X 0.055 33.7 mm 100 mm 6.1 µm 12.5 mm 25 mm M26×0.705
POLL5XA 5X 0.14 33.6 mm 40 mm 2.2 µm 5 mm 25 mm M26×0.705
POLL10XA 10X 0.28 33.4 mm 20 mm 1.2 µm 2.5 mm 25 mm M26×0.705
POLL20XA 20X 0.34 29.5 mm 10 mm 0.8 µm 1.25 mm 25 mm M26×0.705
POLL50XA 50X 0.5 18.9 mm 4 mm 0.7 µm 0.5 mm 25 mm M26×0.705
Main Features
  • Standard/Long working distance objective series (optional)
  • Imaging optical path: 1X (tube lens focal length 180 mm), customizable with different magnification reducers
  • Imaging path image field size: 25 mm
  • Imaging path spectral range: Visible light
  • Camera interface: C/M42/M52 optional
  • Illumination method: Critical/Köhler illumination optional
  • Illumination source: 10 W white/blue LED illumination optional
Application Fields
Geological research Materials science Crystallography analysis Stress birefringence detection
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FM100 - Fluorescence Microscopy System

The Fluorescence Microscope is a microscope used for observing fluorescent or phosphorescent materials. The principle involves illuminating samples wi...

Standard Working Distance Objective Parameters (45 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
Flour2.5XA 2.5X 0.075 6.2 mm 80 mm 4.46 µm 10 mm 25 mm M26×0.705
Flour5XA 5X 0.15 23.5 mm 39 mm 2.2 µm 5 mm 25 mm M26×0.705
Flour10XA 10X 0.3 22.8 mm 20 mm 1.1 µm 2.5 mm 25 mm M26×0.705
Flour20XA 20X 0.4 19.2 mm 10 mm 0.8 µm 1.1 mm 25 mm M26×0.705
Flour50XA 50X 0.55 11 mm 4 mm 0.6 µm 0.44 mm 25 mm M26×0.705
Long Working Distance Objective Parameters (60 mm parfocal distance)
Objective Name Magnification Numerical Aperture Working Distance Focal Length Resolution Object Field Image Field Thread Size
FlourL2XA 2X 0.055 33.7 mm 100 mm 6.1 µm 12.5 mm 25 mm M26×0.705
FlourL5XA 5X 0.14 33.6 mm 40 mm 2.2 µm 5 mm 25 mm M26×0.705
FlourL10XA 10X 0.28 33.4 mm 20 mm 1.2 µm 2.5 mm 25 mm M26×0.705
FlourL20XA 20X 0.34 29.5 mm 10 mm 0.8 µm 1.25 mm 25 mm M26×0.705
FlourL50XA 50X 0.5 18.9 mm 4 mm 0.7 µm 0.5 mm 25 mm M26×0.705
Main Features
  • Standard/Long working distance objective series (optional)
  • Imaging optical path: 1X (tube lens focal length 180 mm), customizable with different magnification reducers
  • Imaging path image field size: 25 mm
  • Imaging path spectral range: Visible light
  • Camera interface: C/M42/M52 optional
  • Illumination method: Critical/Köhler illumination optional
  • Illumination source: 3 W power, 365 nm wavelength LED source
  • Fluorescence module: DAPI single-band UV filter (excitation 365 nm, emission 445 nm, dichroic mirror 405 nm), customizable
Application Fields
Biomedical research Fluorescent labeling detection Cell imaging Paper industry bleaching agent detection
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Special Microscopy System Features

  • Specialized design optimized for specific applications
  • High-quality optical components
  • Modular configuration for easy expansion
  • Suitable for research and industrial inspection
  • Complete system solutions
Selection Guide
Microscopy Technology
Choose the appropriate microscopy method based on sample characteristics
Objective Configuration
Standard or long working distance objectives meet different needs
Illumination System
Köhler or critical illumination available
Camera Interface
Supports C/M42/M52 and various interfaces

Topograph Photoelectric special microscopy systems adopt modular design, providing specialized solutions for different application scenarios to meet the high-end requirements of research and industrial inspection.

System Configuration Solutions

Flexibly combine hardware and software modules based on application requirements

Dimension Key Configuration Technical Highlights User Benefits
Imaging Hardware • ToupCam X Series: IMX415/IMX571 BSI CMOS, up to 45 MP, USB 3.0/HDMI 60 fps 4K
• HCAM/PUM Portable Module: UVC plug-and-play, 8 LED ring light built-in 		• Low read noise & 66 dB+ dynamic range
• Progressive scan + global shutter optional 		True color reproduction, high contrast; meets high-speed AOI, fluorescence weak signal and multi-scenario needs
Zoom Optics • MZO Series (0.25×–8×): 20× zoom ratio, NA 0.12, 174 mm long working distance
• ZOPE All-in-one: Built-in 8 LED & USB camera, parfocal linear zoom 		Dual-end parallel optical path, diffraction-limited MTF, low distortion Zoom without refocusing, view samples from millimeter to micrometer scale
Illumination System • TZM0756DRL 65/85 mm LED ring light: PWM continuously adjustable brightness
• TZM0756CL coaxial light + point source
• AALRL-200 large ring light: 300 mm uniform field 		Multi-channel/polarization/coaxial composite light; LED angle 30° adjustable Solves PCB solder joint glare, wafer scratches, transparent film inspection challenges
Mechanical Platform • TPS-600 coarse/fine adjustment stand (5 kg load capacity)
• TPS-300 precision fine adjustment 2 µm step
• Motorized Z & XY platform (optional) 		Anodized Class II aerospace aluminum, ball screw Long-term 24×7 stable positioning, supports autofocus and array scanning
Software & Algorithm • ToupView: Real-time measurement/annotation, deep focus synthesis, HDR, polarization demodulation
• SDK/API: Windows/macOS/Linux/Android
• AI Module: Defect classification, dimension tolerance judgment 		Secondary development + PLC/robot serial protocol Quick integration into MES/SPC quality systems, supports edge computing and cloud synchronization

System Advantages

Five core advantages building a professional microscopy imaging platform

Complete Ecosystem, Turnkey Delivery

All self-developed cameras, lenses, lighting, stands, and software — no multi-vendor procurement matching needed, plug-and-play saves 60% integration time.

High Resolution + Large Depth of Field

45 MP ultra-high definition CMOS + deep focus synthesis algorithm achieves micrometer-level depth clarity within a 30 mm field of view.

Multi-spectral & Low Light Imaging

Supports white light/near-infrared/polarization combination with coaxial + ring light synchronous exposure; reveals texture details even at 0.05 lux.

Flexible Expansion, Investment Protection

Standard C-Mount and GigE Vision/USB3 Vision protocols allow later upgrades to AI modules, motorized stages, and multi-camera synchronization without replacing the main unit.

Cross-Industry Implementation Cases

  • Semiconductor: Bumping, scratch, wire bond defect AOI
  • FPC/PCB: Solder paste height, pad residue detection
  • New Energy: Lithium battery separator pore size, electrode coating consistency
  • Life Sciences: Tissue sections, entomology, live plant observation
  • Education & Training: University material science virtual experiments, STEAM maker courses

Application Cases

Successful implementation experience across multiple industries

Semiconductor Inspection

Bumping, scratch, wire bond defect automatic optical inspection

Semiconductor Manufacturing
PCB Inspection

High-precision solder paste height and pad residue detection

FPC/PCB Quality Control
New Energy Inspection

Lithium battery separator pore size and electrode coating consistency analysis

New Energy Materials
Life Sciences

Tissue sections, live cell dynamic observation

Life Sciences Research