FM100 Series - Fluorescence Microscopy System

Product Introduction

The Fluorescence Microscope is a microscope used for observing fluorescent or phosphorescent materials. The principle involves illuminating samples with excitation light of specific wavelengths or wavelength bands. The excitation light is absorbed by fluorophores, which then emit light at longer wavelengths. Emission filters separate the emitted light from the excitation light, and the emission light illuminates the detector to achieve fluorescence imaging. In recent years, fluorescence microscopy systems have been widely applied in biological research, such as observing fluorescently labeled biomolecules, making fluorescence microscopes increasingly important.

Technical Features

Standard/Long working distance objective series (optional)
Imaging optical path: 1X (tube lens focal length 180 mm), customizable with different magnification reducers
Imaging path image field size: 25 mm
Imaging path spectral range: Visible light
Camera interface: C/M42/M52 optional
Illumination method: Critical/Köhler illumination optional
Illumination source: 3 W power, 365 nm wavelength LED source
Fluorescence module: DAPI single-band UV filter (excitation 365 nm, emission 445 nm, dichroic mirror 405 nm), customizable

Application Fields

Biomedical research Fluorescent labeling detection Cell imaging Paper industry bleaching agent detection

Product Details

Basic Technical Parameters

Optical System Parameters
Objective Series Standard Working Distance Series / Long Working Distance Series (Optional)
Imaging Optical Path 1X (Tube lens focal length 180 mm), customizable reduction lenses available
Image Plane Size 25 mm
Spectral Range Visible Light
Camera Interface C/M42/M52 options available
Illumination System Parameters
Illumination Method Critical illumination/Kohler illumination options available
Light Source 10W white light/blue light LED illumination options available

Objective Parameters Table

Standard Working Distance Series

Model Magnification Numerical Aperture (NA) Working Distance (WD) Focal Length Resolution Object Field Image Field Thread
Flour2.5XA 2.5X 0.075 6.2 mm 80 mm 4.46 µm 10 mm 25 mm M26×0.705
Flour5XA 5X 0.15 23.5 mm 39 mm 2.2 µm 5 mm 25 mm M26×0.705
Flour10XA 10X 0.3 22.8 mm 20 mm 1.1 µm 2.5 mm 25 mm M26×0.705
Flour20XA 20X 0.4 19.2 mm 10 mm 0.8 µm 1.1 mm 25 mm M26×0.705
Flour50XA 50X 0.55 11 mm 4 mm 0.6 µm 0.44 mm 25 mm M26×0.705

Long Working Distance Series

Model Magnification Numerical Aperture (NA) Working Distance (WD) Focal Length Resolution Object Field Image Field Thread
FlourL2XA 2X 0.055 33.7 mm 100 mm 6.1 µm 12.5 mm 25 mm M26×0.705
FlourL5XA 5X 0.14 33.6 mm 40 mm 2.2 µm 5 mm 25 mm M26×0.705
FlourL10XA 10X 0.28 33.4 mm 20 mm 1.2 µm 2.5 mm 25 mm M26×0.705
FlourL20XA 20X 0.34 29.5 mm 10 mm 0.8 µm 1.25 mm 25 mm M26×0.705
FlourL50XA 50X 0.5 18.9 mm 4 mm 0.7 µm 0.5 mm 25 mm M26×0.705

Product Dimensional Drawing

FM100 Series Dimensional Drawing

System Configuration Solutions

Flexible combination of hardware and software modules based on application requirements

Dimension Key Configuration Technical Highlights User Benefits
Imaging Hardware • ToupCam X Series: IMX415/IMX571 back-illuminated CMOS, up to 45 MP, USB 3.0/HDMI 60 fps 4K
• HCAM/PUM Portable Module: UVC plug-and-play, built-in 8 LED ring light
• Low read noise & 66 dB+ dynamic range
• Progressive scan + optional global shutter
True color reproduction, high contrast; suitable for high-speed AOI, fluorescence weak signal detection and multiple scenarios
Zoom Optics • MZO Series (0.25×–8×): 20× zoom ratio, NA 0.12, 174 mm long working distance
• ZOPE Integrated System: Built-in 8 LED & USB camera, parfocal linear zoom
Dual-ended parallel optical path, diffraction-limited MTF, low distortion Zooming without refocusing, transitioning samples from millimeter to micrometer scale
Illumination System • TZM0756DRL 65/85 mm LED ring light: PWM continuously adjustable brightness
• TZM0756CL coaxial light + point light source
• AALRL-200 large ring light: 300 mm uniform field of view
Multi-channel/polarized/coaxial composite light; LED angle 30° adjustable Solving PCB solder joint glare, wafer scratches, transparent film inspection and other challenges
Mechanical Platform • TPS-600 coarse and fine adjustment stand (5 kg load capacity)
• TPS-300 precision fine adjustment 2 µm step
• Motorized Z & XY platforms (optional)
Anodized Class II aerospace aluminum, ball screw Long-term 24×7 stable positioning, supporting autofocus and array scanning
Software & Algorithms • ToupView: Real-time measurement/annotation, depth compositing, HDR, polarization demodulation
• SDK/API: Windows/macOS/Linux/Android
• AI Module: Defect classification, dimensional tolerance determination
Secondary development + PLC/robot serial protocols Rapid integration into MES/SPC quality systems, supporting edge computing and cloud synchronization

System Advantages

Five core advantages building professional microscopy imaging platforms

Complete Ecosystem, Turnkey Delivery

Cameras, lenses, illumination, stands, and software all developed in-house. No need for multi-vendor procurement coordination, plug-and-play saves 60% integration time.

High Resolution + Large Depth of Field

45 MP ultra-clear CMOS + depth compositing algorithms provide micrometer-level depth-clear images within 30 mm field of view.

Multi-band & Low-Light Imaging

Supports white light, near-infrared, and polarization combinations with synchronized exposure of coaxial and ring lights; presents texture details even at 0.05 lux.

Flexible Expansion, Investment Protection

Standard C-Mount and GigE Vision/USB3 Vision protocols enable later upgrades to AI modules, automated stages, and multi-camera synchronization without replacing the main system.

Cross-Industry Implementation Cases

Semiconductor: Bumping, scratches, bonding wire defect AOI
FPC/PCB: Solder paste height, pad residue detection
New Energy: Lithium battery separator pore size, electrode coating consistency
Life Sciences: Tissue sections, entomology, live plant observation
Education: University materials virtual experiments, STEAM maker courses

Application Cases

Successful implementation experience across multiple industries

Semiconductor Inspection

Bumping, scratches, bonding wire defect automated optical inspection

Semiconductor Manufacturing
PCB Inspection

High-precision detection of solder paste height and pad residue

FPC/PCB Quality Control
New Energy Detection

Lithium battery separator pore analysis, electrode coating consistency analysis

New Energy Materials
Life Sciences

Tissue sections, live cell dynamic observation

Life Sciences Research