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400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 1 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 2 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 3 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 4 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 5 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 6 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 7 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 8 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 9 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 10 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 11 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 12 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 13 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 14 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 15 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 16 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 17 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 18 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 19 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 20 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera thumbnail 21

400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera

Product Introduction

The Sony IMX991 SenSWIR InGaAs sensor features 640×512 VGA resolution with 5 µm pixel size, delivering ultra-high-speed imaging performance (over 400 fps). Suitable for laser analysis, material inspection, high-speed sorting, and other dynamic applications, with support for USB3 / GigE / CoaXPress / CameraLink interfaces.

Product Features

  • Sony IMX991 SenSWIR InGaAs, VGA 640×512
  • 5 µm pixel size, high sensitivity 121 mV (typical)
  • Multi-interface support: USB3 / GigE / CoaXPress / CameraLink
  • Ultra-high-speed acquisition (up to 400 fps @ VGA)
  • 59.6–59.7 dB dynamic range (typical)
  • Global shutter, low distortion
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Product Models

Choose the best 400–1700 nm IMX991 0.33MP InGaAs Series Short-Wave Infrared Camera model for your application needs

Model Sensor Resolution Pixel Size Frame Rate Data Interface Dynamic Range Action
SWIR330KMA
Sony IMX991-AABA-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
400 fps @ 640×512 753 fps @ 320×256
USB3
59.7 dB
View Details
SWIR330KMA-G
Sony IMX991-AABA-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
257.8 fps @ 640×512 486.1 fps @ 320×256
GigE
59.7 dB
View Details
SWIR330KMA-CXP
Sony IMX991-AABA-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
258 fps @ 656×520 486 fps @ 328×260
CoaxPress
58.7 dB
View Details
SWIR330KMB
Sony IMX991-AABJ-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
400 fps @ 640×512 753 fps @ 320×256
USB3
59.6 dB
View Details
SWIR330KMB-G
Sony IMX991-AABJ-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
257.8 fps @ 640×512 486.1 fps @ 320×256
GigE
59.6 dB
View Details
SWIR330KMB-UMV
Sony IMX991-AABJ-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
428.1 fps @ 640×512 807 fps @ 320×256
USB3
59.6 dB
View Details
SWIR330KMB-GMV
Sony IMX991-AABJ-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
257.8 fps @ 640×512 137.1 fps @ 640×512 (12-bit)
GigE
59.6 dB
View Details
SWIR330KMA-CL350
Sony IMX991-AABA-C (InGaAs) 3.20 mm × 2.56 mm
0.33 MP (640×512) 5.0 µm × 5.0 µm
350 fps @ 640×512 657 fps @ 320×256
CameraLink
59.7 dB
View Details

Quantum Efficiency Curve #

IMX991 SenSWIR 400–1700 nm typical quantum efficiency response

IMX991 SenSWIR quantum efficiency curve
* Official reference curve showing the typical change in quantum efficiency across the wavelength range.

Package Contents #

Standard accessories and packing information

  • A Outer shipping carton (not pictured): L 28.2 cm × W 25.2 cm × H 16.7 cm
  • B 3-A protective instrument case: L 28 cm × W 23.0 cm × H 15.5 cm (1 pc, 2.8 kg per case)
  • C SWIR 400–1700 Series USB cooled camera
  • D AC power cable (CN/US/EU/UK: D1/D2/D3/D4, not pictured)
  • E Power adapter: Input AC 100–240 V 50/60 Hz; Output DC 12 V 3 A
  • F High-speed USB 3 Type-A to Type-B gold-plated data cable (1.5 m)
  • G External trigger cable
  • H USB drive with drivers and application software
USB cooled camera kit contents
USB cooled kit contents
  • A Outer shipping carton (not pictured): L 28.2 cm × W 25.2 cm × H 16.7 cm
  • B 3-A protective instrument case: L 28 cm × W 23.0 cm × H 15.5 cm (1 pc, 2.8 kg per case)
  • C SWIR 400–1700 Series GigE cooled camera
  • D AC power cable (CN/US/EU/UK: D1/D2/D3/D4, not pictured)
  • E Power adapter: Input AC 100–240 V 50/60 Hz; Output DC 12 V 3 A
  • F External trigger cable
  • G Ethernet cable: G1 3 m / G2 5 m / G3 10 m (G4 50 m not pictured)
  • H USB drive with drivers and application software
GigE cooled camera kit contents
GigE cooled kit contents
  • A Outer shipping carton (not pictured): L 28.2 cm × W 25.2 cm × H 16.7 cm
  • B 3-A protective instrument case: L 28 cm × W 23.0 cm × H 15.5 cm (1 pc, 2.8 kg per case)
  • C SWIR 400–1700 Series CoaXPress cooled camera
  • D AC power cable (CN/US/EU/UK: D1/D2/D3/D4, not pictured)
  • E Power adapter: Input AC 100–240 V 50/60 Hz; Output DC 12 V 3 A
  • F CoaXPress cable
  • G External trigger cable
  • H USB drive with drivers and application software
CoaXPress cooled camera kit contents
CoaXPress cooled kit contents
  • A 3-A protective instrument case: L 28 cm × W 23.0 cm × H 15.5 cm (1 pc, 2.8 kg per case)
  • B SWIR 400–1700 Series CameraLink cooled camera
  • C Two CameraLink cables
  • D 12 V / 3 A 6-pin aviation power adapter
  • E AC power cable
  • F External trigger cable
CameraLink cooled camera kit contents
CameraLink cooled kit contents
  • A Outer shipping carton (not pictured): L 28.2 cm × W 25.2 cm × H 16.7 cm
  • B 3-A protective instrument case: L 28 cm × W 23.0 cm × H 15.5 cm (1 pc, 2.8 kg per case)
  • C SWIR 400–1700 Series USB uncooled camera
  • D High-speed USB 3 Type-A to Type-B gold-plated data cable (1.5 m)
  • E External trigger cable
  • F USB drive with drivers and application software
USB uncooled camera kit contents
USB uncooled kit contents
Click the buttons above to switch between interface-specific packing lists.

Product Dimensions #

Outline drawings for each interface and cooling configuration

USB cooled camera dimensional drawing
USB Interface
Cooled Dimensional drawing
GigE cooled camera dimensional drawing
GigE Interface
Cooled Dimensional drawing
CameraLink cooled camera dimensional drawing
CameraLink Interface
Cooled Dimensional drawing
USB uncooled camera dimensional drawing
USB Interface
Uncooled Dimensional drawing
GigE uncooled camera dimensional drawing
GigE Interface
Uncooled Dimensional drawing
Click any illustration to view the full-size dimensional drawing.

IMX991 / IMX990 / IMX992 / IMX993 Sensor Comparison

Key specifications of the 400–1700 nm SenSWIR family (current model: IMX991)

This page focuses on the IMX991 (0.33 MP, 640×512, 5.0 µm), a VGA-resolution SenSWIR sensor built for extreme sensitivity and maximum frame rate. The table below helps you compare it with IMX990 (1.3 MP), IMX992 (5 MP), and IMX993 (3 MP) when selecting a camera for your application.

Sensor Resolution Pixel Size Spectral Range Typical Full-Resolution Frame Rate (by interface) Bit Depth Dynamic Range (typical) Available Interfaces
IMX991 Current model 0.33 MP (640×512) 5.0 µm 400–1700 nm USB3: 400 fps; GigE: 257.8 fps;
CoaXPress: ≈258 fps (656×520); CameraLink: 350 fps 		8/12-bit ≈59.6–59.7 dB USB3 / GigE / CoaXPress / CameraLink
IMX990 1.3 MP (1280×1024) 5.0 µm 400–1700 nm USB3: 200 fps; GigE: 90 fps;
CoaXPress: 134 fps; CameraLink: 183 fps 		8/12-bit ≈58.7 dB USB3 / GigE / CoaXPress / CameraLink
IMX992 5.0 MP (2560×2048) 3.45 µm 400–1700 nm USB3: 61.9 fps; 10GigE: 145 fps;
CoaXPress: 131 fps; CameraLink: 124 fps 		Up to 12-bit (selected models support 8/10/12-bit) ≈51.36 / 51.47 dB (HCG / LCG) USB3 / 10GigE / CoaXPress / CameraLink / GigE
IMX993 3.0 MP (2048×1536) 3.45 µm 400–1700 nm USB3: 93 fps; 10GigE: 220 fps;
CoaXPress: 173 fps; CameraLink: 150 fps 		Up to 12-bit (selected models support 8/10/12-bit) ≈51.36 / 51.47 dB (HCG / LCG) USB3 / 10GigE / CoaXPress / CameraLink / GigE
Note: Frame rates are typical full-resolution values from interface-specific documentation. Actual performance depends on bit depth, ROI configuration, and trigger mode.

Frequently Asked Questions

Learn more about SWIR short-wave infrared camera technology

Electromagnetic spectrum diagram: UV 200–380 nm, Visible light 380–750 nm, Near infrared 750–1100 nm, Short-wave infrared 1100–2500 nm, Long-wave infrared 8000–14000 nm
A SWIR camera is a professional imaging device that operates in the short-wave infrared spectrum (approximately 400–1700 nanometers). It can achieve imaging effects that go beyond visible light but differ from thermal imaging cameras (LWIR), making it widely applicable in scenarios requiring high standards for materials, structures, and details.

SWIR cameras have wide applications including industrial inspection, machine vision, material sorting, food testing, scientific research, medical diagnostics, security monitoring, process control, and transportation. They are particularly outstanding in material analysis, moisture detection, penetration through fog/smoke/dust, and night surveillance.

Yes! SWIR cameras can see through certain materials that are opaque to visible light, such as certain plastics and silicon wafers. This capability is extremely valuable for semiconductor inspection, material testing, and other industries.

SWIR cameras primarily capture reflected or emitted light in the short-wave infrared range, unlike thermal imaging cameras (LWIR) which rely on thermal radiation from objects. SWIR cameras have lower thermal sensitivity than thermal imaging cameras and are better suited for structural analysis and material identification rather than direct temperature detection.

Theoretically, yes. SWIR cameras can identify objects or components that cannot be distinguished in visible light through differences in reflection and transmission of materials under short-wave infrared light. They are widely used in security screening, industrial sorting, and inspection applications.

Deep Understanding of SWIR Cameras

Short-Wave Infrared (SWIR) cameras and their core sensors are important components of advanced imaging systems. SWIR technology covers the 900–1700 nanometer wavelength band and has excellent penetration capabilities in harsh environments, such as penetrating fog, smoke, and dust to achieve clear imaging under extreme conditions.

SWIR cameras primarily rely on short-wave infrared light reflection, similar to the visible light band, complementing the application range that thermal imaging cameras (LWIR) cannot cover, providing more complete imaging solutions. They are compact and flexibly integrated, making them easy to apply in various industrial and commercial systems.

The high resolution and high sensitivity of SWIR cameras can meet precision detection and high-requirement applications, capable of detecting minute changes and anomalies in samples, making them very suitable for quality control and defect detection. Some models support cooling, further ensuring imaging quality in high-temperature or high-noise environments.

To reduce system costs and improve integration efficiency, modern SWIR cameras commonly adopt standard optical interfaces and compact designs to accommodate broader application requirements. With the continuous development of imaging markets and technology, SWIR cameras have become one of the key technologies for high-end imaging and sensing in multiple industries due to their unique advantages.

Application Examples

Demonstration of SWIR camera applications in real-world scenarios

SWIR Application Example
Semiconductor Observation

Silicon wafer defect detection and analysis
SWIR Application Example
Long-distance Observation

Clear imaging through haze penetration
SWIR Application Example
Fruit Moisture Observation

Moisture content detection and quality analysis
SWIR Application Example
Temperature Observation

Imaging monitoring in high-temperature environments
SWIR Application Example
Agricultural Spectral Remote Sensing

UAV multispectral monitoring applications
SWIR Application Example
Material Sorting

Intelligent plastic waste classification
SWIR Application Example
Liquid Level Detection

Liquid level monitoring in opaque containers
SWIR Application Example
Glass Defect Detection

High-temperature glass penetration inspection

More Application Industry References

  • Semiconductor Industry: Solar cell and chip inspection
  • Agriculture: Spectral remote sensing applications via multirotor aircraft
  • Recycling Industry: Material sorting of plastics, waste, and other materials
  • Medical Imaging and Research: Hyperspectral and multispectral imaging
  • Food Industry: Quality inspection and grading
  • Beverage Industry: Liquid level detection in opaque containers
  • Packaging: Seal inspection
  • Glass Industry: High-temperature glass penetration defect detection
  • Printing Industry: See-through hidden features
  • Video Surveillance: Visual enhancement (e.g., smoke penetration)
  • Security: Counterfeit detection, such as currency, wigs, or skin