E3ISPM20000KPA-U3-CL Microscopy Camera

Product Introduction

Dual-interface industrial camera specifically designed for network isolation and redundant deployment. Features Sony IMX183CQK back-illuminated CMOS sensor providing 20-megapixel high-resolution imaging. USB3.0 and CameraLink interfaces can operate simultaneously, outputting identical data streams to different devices. Built-in hardware ISP processor supports Demosaic, auto-exposure, gamma correction and other functions, effectively reducing host load. Equipped with 512 MB DDR3 buffer and optically isolated I/O to ensure stable operation in industrial environments.

Key Features

Dual interface parallel output: USB3.0 and CameraLink can simultaneously connect to different devices outputting identical data
Interface function separation: USB interface handles camera control, CameraLink interface focuses on data transmission
Sony IMX183CQK sensor: 1-inch 20-megapixel back-illuminated CMOS technology
Hardware ISP processing: Demosaic, AE/AGC, gamma, LUT completed within the camera
High-speed buffer: 512 MB DDR3 buffer zone ensuring data transmission stability
High image quality output: 72 dB dynamic range, 41.8 dB signal-to-noise ratio, 3.24 e- readout noise

Flexible acquisition modes: Support for ROI, windowing, multi-resolution high-speed acquisition
Industrial-grade I/O: Optically isolated input/output with strong anti-interference capability
Multiple binning modes: Hardware 2×2/3×3, software 2×2/3×3/4×4
Low power consumption design: Only 7 W power consumption supporting long-term continuous operation
Wide temperature range: -10 °C to +50 °C operating temperature
Complete software support: ToupView software and Windows/Linux SDK

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Product Details

Key Parameters
Model	E3ISPM20000KPA-U3-CL
Sensor	IMX183CQK (C, RS)
Effective Pixels / Resolution	20.0MP (5440×3684)
Frame Rate (Full Resolution)	18.6 fps@5440×3684; 49.8 fps@2736×1824; 60.7 fps@1824×1216
Shutter Type	Rolling Shutter
Color Type	Color
Imaging Performance
Pixel Size	2.4 µm × 2.4 µm
Sensor Size	13.06 mm × 8.84 mm
Diagonal	1" (15.77 mm)
Dynamic Range	72 dB
Bit Depth	8/12-bit
Sensitivity	462 mV @1/30s
Dark Current	0.2 mV @1/30s
Read Noise	3.24 e-
Full Well Capacity	15.0 ke-
Signal-to-Noise Ratio	41.8 dB
Conversion Gain	3.69 e-/ADU
Interface & Mechanical
Data Interface	USB3.0(USB3.1 GEN1)/CameraLink
GPIO	1 optically isolated input, 1 optically isolated output, 2 non-isolated input/output ports
Lens Mount	C-mount
Buffer Memory	512 MB DDR3
Feature Functions
Gain Range	1-50×
Exposure Time	53 µs-15s
Binning	Hardware 2×2, 3×3; Software 2×2, 3×3, 4×4
Physical Parameters
Power Supply	DC12V
Power Consumption	7 W
Dimensions	88 mm × 68.4 mm × 101.3 mm
Weight	524 g
Certification	CE/FCC

E3ISPM20000KPA-U3-CL is an innovative dual-interface parallel output industrial camera, featuring the high-performance IMX183CQK (C, RS) image sensor with the following characteristics:

Dual-Interface Parallel Output: USB3.0 and CameraLink simultaneous output, capable of transmitting identical data streams to different devices concurrently, perfectly addressing network isolation and redundant deployment requirements
20 MP Ultra-High Resolution: 20.0MP (5440×3684) resolution, 2.4 µm × 2.4 µm pixel size, 1-inch large sensor
Hardware ISP Processor: Built-in hardware ISP supporting Demosaic, AE/AGC, Gamma correction, LUT and other processing, significantly reducing host CPU load
512 MB High-Speed Buffer: Equipped with 512 MB DDR3 buffer, ensuring stable high-speed burst capture and data transmission
Outstanding Imaging Performance: 72 dB dynamic range, 41.8 dB signal-to-noise ratio, 3.24 e- read noise, excellent image quality
Flexible Operating Modes: Supports USB standalone, CameraLink standalone, or dual-interface simultaneous operation, adapting to various application scenarios
Industrial-Grade Design: Optically isolated I/O interface, low power consumption 7 W design, suitable for 24/7 continuous operation

Recommendation

E3ISPM20000KPA-U3-CL with its unique dual-interface parallel output design, hardware ISP processing capability, and 20 MP high-resolution imaging, is the ideal choice for network isolation systems, redundant backup deployment, and high-end industrial inspection. Particularly suitable for professional applications requiring high reliability and data security, such as semiconductor manufacturing, PCB inspection, and LCD panel inspection.

E3ISPM20000KPA-U3-CL Product Manual

PDF format, including detailed technical parameters and dimensional drawings

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SDK Development Kit

Supporting Windows, Linux, macOS and other platforms

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3D Model Files

STEP format for mechanical design integration

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Frequently Asked Questions

Explore the technology behind the E3ISPM-U3-CL dual-interface microscopy cameras.

The E3ISPM-U3-CL series is ToupTek’s innovative dual-interface industrial camera featuring synchronized USB3.0 and CameraLink outputs. It uses a Sony IMX183CQK 20 MP back-illuminated CMOS sensor. The USB interface provides unified control, while the CameraLink interface handles high-speed data delivery. Both interfaces can stream identical image data to different systems simultaneously, solving challenges such as segregated networks and redundant deployments. A built-in hardware ISP processor and 512 MB DDR3 buffer make the camera ideal for advanced industrial inspection and scientific imaging.

Physical network isolation: The USB interface connects to the internal control system, while the CameraLink interface feeds an external processing server, ensuring true isolation.
Redundant backup: Two synchronized outputs deliver identical data—one for real-time analysis, the other for archiving—boosting system reliability.
Multi-system collaboration: Simultaneously integrate machine vision, deep-learning, or other platforms to maximize equipment utilization.
Control/data separation: USB manages camera parameters; CameraLink focuses on data transfer, preventing control signals from affecting throughput.
Flexible deployment: Supports 1+1, 1+0, and 0+1 modes to adapt to diverse scenarios.

Demosaicing: Hardware Bayer-to-RGB conversion is more than 10× faster than host-side processing.

Automatic exposure/gain: AE/AGC are executed inside the camera with sub-millisecond response.

Gamma correction: Real-time hardware gamma curves output linear or nonlinear imagery.

Lookup tables (LUTs): Custom LUTs enable special color mapping and pseudocolor visuals.

Lower CPU load: Pre-processing occurs in-camera, reducing host CPU usage by over 60%.

Low latency: Hardware processing adds less than one frame of delay, perfect for real-time control.

Physical isolation architecture: The USB3.0 interface connects to the internal control workstation for parameter management and triggering; the CameraLink interface connects to an external processing server that only receives image data.

One-way data flow: Image data travels from the camera to the external system via CameraLink; the external network cannot issue control commands back to the camera.

Independent power: The camera uses a dedicated 12 V supply rather than USB or CameraLink power, avoiding coupling risks.

Optically isolated I/O: Trigger and sync signals use opto-isolation to suppress ground loops and EMI.

Regulatory compliance: Meets China MLPS 2.0 (Multi-Level Protection Scheme) physical isolation requirements for government, defense, finance, and other high-security deployments.

Versus USB3.0-only cameras: Adds a CameraLink channel for longer cable runs (up to 10 m) and stronger anti-interference capability.

Versus CameraLink-only cameras: Adds a universal USB3.0 interface that requires no frame grabber, cutting deployment cost by more than 50%.

Flexibility: Use either interface independently or run both at once to suit evolving workflows.

Compatibility: USB supports Windows, Linux, and macOS; CameraLink works with all standard frame grabbers.

Cost effectiveness: One camera covers use cases that previously required two devices.

Easy maintenance: Unified firmware and SDK simplify updates and servicing.

USB + CameraLink: Ideal for segregated networks, redundant backups, and multi-system workflows.

USB-only: Fits lab R&D, portable inspection tools, and temporary deployments.

CameraLink-only: Best for high-speed production lines, long-distance transmission, or EMI-heavy environments.

Mode switching: Configure via SDK without hardware changes; hot switching is supported.

Performance: Running both interfaces simultaneously does not compromise single-interface performance.

In-Depth Technical Overview

USB3.0 + CameraLink Parallel Output

The E3ISPM-U3-CL series pioneers dual-interface parallel output: USB3.0 manages camera control and configuration while CameraLink delivers high-speed data. Both interfaces can stream identical image data to separate devices, enabling “one camera, multiple outputs.” The design solves challenges such as network isolation, redundant backups, and multi-system collaboration. USB connectivity eliminates the need for a dedicated frame grabber, whereas CameraLink provides industrial-grade transport with cable lengths up to 10 m.

Hardware ISP Image Processing

A high-performance hardware ISP handles demosaicing, auto exposure/gain, gamma correction, and custom LUT processing entirely inside the camera. Compared with software workflows, the hardware pipeline is more than ten times faster and keeps latency below 1 ms. By offloading image preprocessing, host CPU load drops by more than 60%, leaving ample resources for analytics and decision logic—especially important in multi-camera installations.

Sony IMX183 Back-Illuminated CMOS Sensor

The Sony IMX183CQK 1-inch back-illuminated CMOS sensor delivers 20 MP (5440×3684) resolution with 2.4 µm × 2.4 µm pixels. The back-illuminated structure boosts quantum efficiency and light conversion. The sensor offers 72 dB dynamic range, a 41.8 dB signal-to-noise ratio, read noise of 3.24 e⁻, and a full-well capacity of 15.0 ke⁻. A halo-free design prevents blooming under intense illumination, ensuring dependable results in challenging lighting.

512 MB DDR3 High-Speed Buffer

An on-board 512 MB DDR3 buffer stores roughly 25 full-resolution frames to guarantee zero frame loss during burst acquisition. The buffer smooths data peaks and prevents host-side delays from dropping frames. When both interfaces are active, the buffer synchronizes distribution so each channel receives identical data—ideal for high-speed batch capture and time-series imaging.

Physical Network Isolation Workflow

The dual-interface architecture inherently supports segregated networks. The USB3.0 interface connects to the internal control system for configuration and triggering, while the CameraLink interface links to external analytics servers for unidirectional data reception. Image data flows outward only, preventing external systems from issuing commands back to the camera. This satisfies China MLPS 2.0 isolation requirements and is widely adopted in government, defense, finance, and other security-conscious sectors.

Industrial Reliability

The all-metal housing provides excellent heat dissipation and supports a wide operating range from -10 °C to 50 °C. Power consumption is just 7 W, making the camera suitable for 24/7 duty cycles. Opto-isolated GPIO interfaces mitigate ground offsets and EMI, while the dedicated 12 V supply avoids interface power limitations. CE and FCC certifications ensure electromagnetic compatibility, allowing dependable operation in harsh industrial environments.