E3ISPM20000KPA-U3-CL Microscopy Camera
Product Introduction
Touptek's E3ISPM-U3-CL series industrial cameras feature an innovative dual interface design with USB3.0 and CameraLink parallel output, enabling simultaneous connection to different devices with identical data streams, perfectly addressing network isolation and redundant deployment requirements. The USB interface handles unified control while the CameraLink interface focuses on high-speed data transmission, with both operating independently without interference.
Equipped with the Sony IMX183CQK back-illuminated CMOS sensor, providing 20-megapixel high-resolution imaging with 72 dB high dynamic range. The camera features built-in hardware ISP processing, completing Demosaic, AE/AGC, gamma correction, LUT and other image processing operations within the camera, significantly reducing host computational load. Configured with 512 MB DDR3 high-speed buffer to ensure data transmission stability.
Typical applications: Semiconductor inspection, PCB inspection, LCD panel inspection, scientific imaging, microscopy imaging, industrial automation, machine vision system integration, network-isolated systems, redundant backup systems.
Key Features
- USB3.0 + CameraLink dual interface parallel output, simultaneously outputting identical data to different devices
- USB interface for unified control, CameraLink interface dedicated to streaming, facilitating network-isolated deployments
- Sony IMX183CQK back-illuminated CMOS sensor with 20-megapixel high resolution
- Hardware ISP integration: Demosaic, AE/AGC, gamma, LUT and other processing completed within the camera
- 512 MB DDR3 high-speed buffer with glow-free design
- 72 dB high dynamic range, 41.8 dB signal-to-noise ratio
- Support for ROI windowing and multi-resolution high-speed acquisition
- Industrial-grade optically isolated I/O interfaces with strong anti-interference capability
- Support for hardware binning (2×2, 3×3) and software binning (2×2, 3×3, 4×4)
- Low power consumption design (7 W), suitable for 7×24 hour continuous operation
- C-mount standard lens interface
- Bundled ToupView software and complete SDK development package
- CE/FCC certified with industrial-grade reliability
Product Details
| Key Parameters | |
| Model | E3ISPM20000KPA-U3-CL |
| Sensor | IMX183CQK (C, RS) |
| Effective Pixels / Resolution | 20.0MP (5440×3684) |
| Frame Rate (Full Resolution) | 18.6 fps@5440×3684; 49.8 fps@2736×1824; 60.7 fps@1824×1216 |
| Shutter Type | Rolling Shutter |
| Color Type | Color |
| Imaging Performance | |
| Pixel Size | 2.4 µm × 2.4 µm |
| Sensor Size | 13.06 mm × 8.84 mm |
| Diagonal | 1" |
| Dynamic Range | 72 dB |
| Bit Depth | 8/12-bit |
| Sensitivity | 462 mV @1/30s |
| Dark Current | 0.2 mV @1/30s |
| Read Noise | 3.24 e- |
| Full Well Capacity | 15.0 ke- |
| Signal-to-Noise Ratio | 41.8 dB |
| Conversion Gain | 3.69 e-/ADU |
| Interface & Mechanical | |
| Data Interface | USB3.0(USB3.1 GEN1)/CameraLink |
| GPIO | 1 optically isolated input, 1 optically isolated output, 2 non-isolated input/output ports |
| Lens Mount | C-mount |
| Buffer Memory | 512 MB DDR3 |
| Feature Functions | |
| Gain Range | 1-50× |
| Exposure Time | 53 µs-15s |
| Binning | Hardware 2×2, 3×3; Software 2×2, 3×3, 4×4 |
| Physical Parameters | |
| Power Supply | DC12V |
| Power Consumption | 7 W |
| Dimensions | 88 mm × 68.4 mm × 101.3 mm |
| Weight | 524 g |
| Certification | CE/FCC |
E3ISPM20000KPA-U3-CL is an innovative dual-interface parallel output industrial camera, featuring the high-performance IMX183CQK (C, RS) image sensor with the following characteristics:
- Dual-Interface Parallel Output: USB3.0 and CameraLink simultaneous output, capable of transmitting identical data streams to different devices concurrently, perfectly addressing network isolation and redundant deployment requirements
- 20 MP Ultra-High Resolution: 20.0MP (5440×3684) resolution, 2.4 µm × 2.4 µm pixel size, 1-inch large sensor
- Hardware ISP Processor: Built-in hardware ISP supporting Demosaic, AE/AGC, Gamma correction, LUT and other processing, significantly reducing host CPU load
- 512 MB High-Speed Buffer: Equipped with 512 MB DDR3 buffer, ensuring stable high-speed burst capture and data transmission
- Outstanding Imaging Performance: 72 dB dynamic range, 41.8 dB signal-to-noise ratio, 3.24 e- read noise, excellent image quality
- Flexible Operating Modes: Supports USB standalone, CameraLink standalone, or dual-interface simultaneous operation, adapting to various application scenarios
- Industrial-Grade Design: Optically isolated I/O interface, low power consumption 7 W design, suitable for 24/7 continuous operation
Recommendation
E3ISPM20000KPA-U3-CL with its unique dual-interface parallel output design, hardware ISP processing capability, and 20 MP high-resolution imaging, is the ideal choice for network isolation systems, redundant backup deployment, and high-end industrial inspection. Particularly suitable for professional applications requiring high reliability and data security, such as semiconductor manufacturing, PCB inspection, and LCD panel inspection.
E3ISPM20000KPA-U3-CL Product Manual
PDF format, including detailed technical parameters and dimensional drawings
SDK Development Kit
Supporting Windows, Linux, macOS and other platforms
3D Model Files
STEP format for mechanical design integration
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