BSM Series Short-Wave Infrared Modular Microscopy System
Product Introduction
The BSM Series Short-Wave Infrared (SWIR) modular microscopy system represents a next-generation SWIR microscopy imaging technology platform, extending the imaging range from traditional visible spectrum (400-700 nm) to the 900-1700 nm band. The system employs high-sensitivity InGaAs sensor technology combined with the professional M Plan Apo NIR objective series, breaking through the optical barrier of silicon-based materials to achieve penetrative non-destructive inspection. Through modular architecture design integrating advanced illumination modules, imaging modules, and precision mechanical modules, it provides micrometer-resolution subsurface defect detection capabilities for semiconductor manufacturing, materials science, and industrial inspection fields. The system utilizes standard glass lenses, avoiding expensive reflective optical elements and significantly reducing the technical barrier and application cost of SWIR imaging.
Product Features
- Full coverage of 900-1700 nm SWIR imaging band
- Silicon material penetrative imaging technology for non-destructive internal inspection
- Three tube lens systems available (BSM-T180VA/T090VA/T100VA)
- Maximum 33 mm image field design, compatible with large-format sensors
- M Plan Apo NIR professional objective series (5X-50X HR)
- 0.4 µm ultra-high optical resolution (50X HR objective)
- Coaxial epi-illumination Köhler illumination system
- Integrated 1200/1300/1400/1550 nm multi-wavelength LED light sources
- Compatible with high-performance InGaAs sensor cameras (0.33M-5.0M)
- Real-time imaging capability with frame rates up to 400 fps@640×512
- TEC cooling technology ensuring low-noise, high SNR imaging
- Standard C-mount design compatible with various camera systems
- Modular architecture supporting flexible customization and upgrades
- Precision CNC machining with anti-vibration design
- Standard glass optical system for cost-effectiveness optimization
System Configuration and Parameters
SWIR microscopy imaging technology breaking traditional optical limitations, providing revolutionary solutions for semiconductor and material inspection
System Technical Principles
The BSM Series utilizes the unique physical properties of short-wave infrared light to achieve penetrative imaging of silicon-based materials and other semiconductor materials. Through precise optical design and high-sensitivity sensors, the system visualizes internal structures that cannot be observed with traditional microscopes.
Silicon Penetrative Imaging Technology
SWIR photon energy is below the silicon bandgap (1.1 eV), enabling penetration through silicon-based materials for non-destructive detection of internal defects including micro-cracks and welding failures
Optical System Compatibility
Employs standard glass lens system, avoiding expensive reflective optical elements required for mid-wave and long-wave infrared imaging, reducing manufacturing costs and simplifying system integration
Modular Architecture Design
Independent design of illumination, imaging, and mechanical modules, supporting customized upgrades based on specific wavelength, sensor, or automation requirements
Enhanced Material Contrast
SWIR wavelengths improve visibility of features obscured in visible light, enabling clear imaging of internal structures in composite materials
Tube Lens System Configuration
Standard Configuration - Universal Inspection Platform
Model: BSM-T180VA / BSM-T090VA
- Tube Lens Focal Length
- 180 mm / 90 mm
- Image Field Size
- 24 mm (180 mm tube lens)
- Spectral Range
- 900-1700 nm
- Illumination Method
- Coaxial epi-illumination Köhler
- LED Light Sources
- 1200/1300/1400/1550 nm
High-End Configuration - Ultimate Performance Platform
Model: BSM-T100VA
- Tube Lens Focal Length
- 100 mm
- Image Field Size
- 33 mm (200 mm tube lens)
- Spectral Range
- 900-1700 nm
- Illumination Method
- Coaxial epi-illumination Köhler
- LED Light Sources
- 1200/1300/1400/1550 nm
M Plan Apo NIR Objective Series
High-performance microscopy objectives specifically optimized for SWIR band, providing exceptional imaging quality and penetration capability
| Model | Magnification | NA | WD | Focal Length | Resolution | Depth of Field | FN | Weight |
|---|---|---|---|---|---|---|---|---|
| M Plan Apo NIR 5X | 5X | 0.14 | 37.5 mm | 40 mm | 2.0 µm | 14 µm | 24 mm | 220 g |
| M Plan Apo NIR 10X | 10X | 0.26 | 30.5 mm | 20 mm | 1.1 µm | 4.1 µm | 24 mm | 250 g |
| M Plan Apo NIR 20X | 20X | 0.4 | 20 mm | 10 mm | 0.7 µm | 1.7 µm | 24 mm | 300 g |
| M Plan Apo NIR 50X | 50X | 0.42 | 17 mm | 4 mm | 0.7 µm | 1.6 µm | 24 mm | 315 g |
|
M Plan Apo NIR 50X HR High-resolution version |
50X | 0.65 | 10 mm | 4 mm | 0.4 µm | 0.7 µm | 24 mm | 450 g |
SWIR Series Camera Configuration
High-performance InGaAs sensor cameras equipped with TEC cooling, providing excellent signal-to-noise ratio and imaging quality
SWIR5000KMA
- Sensor
- 5.0M IMX992 (M,GS)
- Sensor Size
- 1/1.4'' (8.94×7.09 mm)
- Pixel Size
- 3.45×3.45 µm
- SNR
-
High Gain: 51.5 dB
Low Gain: 48.5 dB - Frame Rate
-
61.9@2560×2048
135.7@1280×1024 - Exposure Time
- 15 µs~60 s
- Cooling
- Built-in TEC
SWIR3000KMA
- Sensor
- 3.0M IMX993 (M,GS)
- Sensor Size
- 1/1.8'' (7.07×5.3 mm)
- Pixel Size
- 3.45×3.45 µm
- SNR
-
High Gain: 51.5 dB
Low Gain: 48.5 dB - Frame Rate
-
93@2048×1536
176@1024×768 - Exposure Time
- 15 µs~60 s
- Cooling
- Built-in TEC
SWIR1300KMA
- Sensor
- 1.3M IMX990 (M,GS)
- Sensor Size
- 1/2'' (6.40×5.12 mm)
- Pixel Size
- 5×5 µm
- SNR
-
High Gain: 58.7 dB
Low Gain: 52.6 dB - Frame Rate
-
200@1280×1024
392@640×512 - Exposure Time
- 15 µs~60 s
- Cooling
- Built-in TEC
SWIR330KMA
- Sensor
- 0.33M IMX991 (M,GS)
- Sensor Size
- 1/4'' (3.20×2.56 mm)
- Pixel Size
- 5×5 µm
- SNR
-
High Gain: 58.7 dB
Low Gain: 52.6 dB - Frame Rate
-
400@640×512
753@320×256 - Exposure Time
- 15 µs~60 s
- Cooling
- Built-in TEC
Typical Application Cases
Professional applications of BSM system in semiconductor manufacturing, materials science, and other fields
Semiconductor Manufacturing and Inspection
The BSM Series enables non-destructive inspection of internal defects in silicon wafers and chips during semiconductor manufacturing processes. The system can penetrate silicon-based materials to clearly reveal subsurface defects, micro-cracks, and interconnect structures, providing critical technical support for chip quality control and failure analysis.
Application Case
- Non-destructive inspection of internal defects in silicon wafers
- Chip interconnect structure integrity assessment
- Precise localization of subsurface micro-cracks
- Real-time monitoring of welding quality
- Package integrity verification
Ceramic Material Defect Detection
The system plays a crucial role in ceramic and composite material inspection, capable of identifying subsurface cracks, porosity, and inclusions. SWIR imaging technology reveals internal structural defects that cannot be observed with traditional optical methods, providing reliable basis for material quality assessment.
Application Case
- Visualization of internal cracks in ceramics
- Delamination detection in composite materials
- Porosity distribution analysis
- Inclusion identification and localization
- Structural integrity assessment
More Application Fields
Industrial Non-Destructive Testing
The BSM Series provides high-precision non-destructive testing capabilities for industrial components. The system can analyze internal structures, detect assembly defects, and evaluate material uniformity, completing comprehensive quality assessment without destructive disassembly.
- Component internal structure analysis
- Assembly quality verification
- Material uniformity assessment
Materials Science Research
The system is used in materials science research to analyze the microstructure, phase distribution, and defect characteristics of new materials. SWIR imaging provides unique material contrast, helping understand the relationship between material properties and microstructure.
- New material structure characterization
- Phase distribution visualization
- Grain boundary observation and analysis
Technical Advantage Comparison
| Comparison Technology | BSM System Advantages |
|---|---|
| Traditional Optical Microscopy | BSM system can penetrate silicon-based and other opaque materials to observe internal structures, while traditional microscopes can only observe surfaces |
| X-ray Inspection | BSM system has no radiation hazards, higher resolution, enables real-time imaging, with lower equipment and maintenance costs |
| Ultrasonic Testing | BSM system provides higher spatial resolution and image clarity, capable of identifying micrometer-level defects |
| Mid-wave/Long-wave Infrared Systems | BSM system uses standard glass optical elements with lower cost and better compatibility with existing microscope platforms |
System Configuration and Accessories
Standard Configuration
- BSM main system (BSM-T180VA/T090VA/T100VA selectable)
- Multi-wavelength LED light source module
- Coaxial epi-illumination system
- C-mount camera adapter
- Precision focusing mechanism
Optional Accessories
- M Plan Apo NIR objective series (5X-50X HR)
- SWIR camera series (330K-5000K resolution)
- Automated sample stage
- Image acquisition and analysis software
- Anti-vibration platform
- Custom wavelength LED sources
The BSM Series features modular architecture design, supporting customized upgrades based on specific wavelength, sensor, or automation requirements
BSM System Advantages
Revolutionary SWIR microscopy imaging technology, opening a new era of material internal inspection
Silicon Penetration Imaging Capability
SWIR photon energy is below the silicon band gap, enabling non-destructive detection of internal defects in silicon-based materials, including micro-cracks, solder failures, and other subsurface defects.
Wide-Band Imaging Coverage
900-1700 nm wide-band imaging capability with multi-wavelength LED light sources, meeting imaging requirements for different materials and applications.
Modular Architecture Design
Independent design of illumination, imaging, and mechanical modules, supporting customized upgrades based on specific requirements, ensuring system flexibility and expandability.
Cost-Effective Solution
Uses standard glass optical elements, avoiding expensive reflective optical systems, reducing equipment costs and maintenance fees.
Real-Time Imaging Capability
High-speed InGaAs sensors support real-time imaging with frame rates up to 400 fps, meeting online inspection and dynamic observation requirements.
Micron-Level Resolution
Professional M Plan Apo NIR objective series achieves resolution up to 0.4 µm, precisely identifying minute defects and structural details.