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Industrial Camera/Machine Vision/Automation

SWIR Camera

Product Description

The cameras mentioned in this manual are imaging capture devices which useUSB3.0 / GigE to transmit uncompressed images in real time. They support image acquisition and parameter setting (such as working mode, image parameter adjustment etc.) through client-side user-friendly software.

SWIR(Short-Wavelength Infrared) series are TE-Cooling USB3.0 / GigE InGaAs cameras;

IUX series is USB3.0 / GigE interface cameras for industrial applications. It includes IUA and IUC.

I3ISPM series is USB3.0 interface color camera for industrial applications, having built-in hardware ISP to ensure color reproduction and higher video speed. The resolution coverage is from 0.5MP to 20MP.

I3CMOS series is USB3.0 interface monochrome camera for industrial applications. The resolution coverage is from 0.5MP to 20MP.

Main Features

  • Sony Exmor back-illuminated CMOS sensor;
  • USB 3.0 data transmission interface compatible with USB2.0 protocol;
  • Provides advanced video and image processing application software ToupView, compatible with Windows/Linux/OSX multi-platform SDK, support native C/C++, C#/VB.Net, DirectShow, Twain API;
  • Supports external triggering, software and capture modes;
  • Supports ROI, flip, bit-depth switching and other features;
  • Supports firmware worksite upgrading;
  • Compliant with CE, FCC requirements.

    • SWIR Series Camera

    Model Number

    Image Sensor

    Pixel Size(μm)

    G Sensitivity/Dark Signal

    Data Interface

    FPS/Resolution

    Binning

    Exposure Time
    Dimensions

    SWIR1300KMA

    1.3M/IMX990(M)
    1/2”(6.40x5.12)
    Buit-in TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    200@1280x1024
    392@640x512

    1x1
    1x1

    15us~60s
    80mm

    SWIR1300KMB

    1.3M/IMX990(M)
    1/2”(6.40x5.12)
    External TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    200@1280x1024
    392@640x512

    1x1
    1x1

    15us~60s
    80mm

    SWIR330KMA

    0.33M/IMX991(M)
    1/4”(3.20x2.56)
    Buit-in TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    400@640x512
    753@320x256

    1x1
    1x1

    15us~60s
    80mm

    SWIR330KMB

    0.33M/IMX991(M)
    1/4”(3.20x2.56)
    External TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    400@640x512
    753@320x256

    1x1
    1x1

    15us~60s
    80mm

    SWIR5000KMA
    20240308

    5.0M/IMX992(M,GS)
    1/1.4”(8.94x7.09)
    Buit-in TEC

    3.45x3.45

    TBD

    USB3

    61.9@2560x2048
    135.7@1280x1024

    1x1
    1x1

    15us~60s
    80mm

    SWIR5000KMB
    20240308

    5.0M/IMX992(M,GS)
    1/1.4”
    External TEC

    3.45x3.45

    TBD

    USB3

    61.9@2560x2048
    135.7@1280x1024

    1x1
    1x1

    15us ~60s
    80mm

    SWIR1300KMB-UMV
    20230825

    1.3M/IMX990(M,GS)
    1/2”(6.40x5.12)

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    223@1280x1024
    428@640x512

    1x1
    1x1

    15us~60s
    33mm

    SWIR330KMB-UMV
    20230825

    0.33M/IMX991(M,GS)
    1/4”(3.20x2.56)

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    USB3

    428@640x512
    807@320x256

    1x1
    1x1

    15us~60s
    33mm

    SWIR5000KMB-UMV
    20240308

    5.0M/IMX992(M,GS)
    1/1.4”

    3.45x3.45

    TBD

    USB3

    61.9@2560x2048
    135.7@1280x1024

    1x1
    1x1

    15us~60s
    33mm

    SWIR1300KMA-G

    1.3M/IMX990(M)
    1/2”(6.40x5.12)
    Buit-in TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    GigE

    90@1280x1024
    253@640x512

    1x1
    1x1

    15us~60s
    80mm

    SWIR1300KMB-G

    1.3M/IMX990(M)
    1/2”(6.40x5.12)
    External TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    GigE

    90@1280x1024
    253@640x512

    1x1
    1x1

    15us~60s
    80mm

    SWIR330KMA-G

    0.33M/IMX991(M)
    1/4”(3.20x2.56)
    Buit-in TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    GigE

    258.8@640x512
    486.1@320x256

    1x1
    1x1

    50us~60s
    80mm

    SWIR330KMB-G

    0.33M/IMX991(M)
    1/4”(3.20x2.56)
    External TEC

    5x5

    121mV with 1/30s
    1.0mV with 1/30s

    GigE

    258.8@640x512
    486.1@320x256

    1x1
    1x1

    50us~60s
    80mm

    SWIR5000KMA-G
    20240308

    5.0M/IMX992(M,GS)
    1/1.4”
    Buit-in TEC

    3.45x3.45

    TBD

    GigE

    22@2560x2048
    88@1280x1024

    1x1
    1x1

    15us~60s
    80mm

    SWIR5000KMB-G
    20240308

    5.0M/IMX992(M,GS)
    1/1.4”
    External TEC

    3.45x3.45

    TBD

    GigE

    22@2560x2048
    88@1280x1024

    1x1
    1x1

    15us~60s
    80mm

    SWIR5000KMA-10G
    20240313

    5.0M/IMX992(M,GS)
    1/1.4”
    Buit-in TEC

    3.45x3.45

    TBD

    GigE

    131.9@2560x2048

    1x1

    15us~60s
    80mm

    SWIR5000KMB-10G
    20240313

    5.0M/IMX992(M,GS)
    1/1.4”
    External TEC

    3.45x3.45

    TBD

    GigE

    131.9@2560x2048

    1x1

    15us~60s
    80mm
    SWIR

    SWIR

    SWIR series is a TE-Cooling USB3.0 / GigE / CL interface visible+short-wave infrared camera which adopts SONY SenSWIR InGaAs sensor. With 400nm-1800nm wide band response or 900nm-1700nm short wave infrared response. This camera has high quantum efficiency and high sensitivity;

    ToupTek

    ToupTek Photonics has become one of the top brands in the microscope and astronomy fields,providing digital imaging solutions and services to thousands of customers. ToupTek has a perfect after-sales service platform that can provide timely and efficient technical support and after-sales service for microscopy systems,microscopic digital imaging,and astronomical imaging products.

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    Professional Imaging

    ToupTek is dedicated to the advancement and application of optoelectronic technologies. Grounded in the principle of simplifying the imaging process,we endeavor to furnish our clientele with an enhanced imaging experience. We shall persist in propelling scientific and technological advancement,broadening market territories,and fostering close collaborations with international allies to collectively forge a luminous future for the optoelectronics sector.